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Epoxy resin is typically used post-1930s and is an indication of modern conservation work. Generally, epoxy is very hard, but unlike shellac it is not brittle. The color of epoxy resin can range from yellow/green to a dark yellow/brown. Yellowing of the resin is an indication of aging.
Electropolishing, also known as electrochemical polishing, anodic polishing, or electrolytic polishing (especially in the metallography field), is an electrochemical process that removes material from a metallic workpiece, reducing the surface roughness by levelling micro-peaks and valleys, improving the surface finish.
A very good way is the use of piston metering heads. The ratio of resin to hardener can be determined exactly by the ratio of the width of two separate pistons, one for resin, one for hardener, where both pistons are pushed simultaneously. The amount is determined by a common stopper, limiting the stroke of both pistons equally.
J-B Weld epoxy is a two-part adhesive that can bond various surfaces and withstand high temperatures up to 500 °F (260 °C) constantly and 600 °F (316 °C) for short periods. It is water-resistant, petroleum/chemical-resistant, acid-resistant, and resists shock, vibration, and temperature fluctuations.
Coating material (after curing) should have a thickness of 30–130 μm (0.0012–0.0051 in) when using acrylic resin, epoxy resin, or urethane resin. For silicone resin, the coating thickness recommended by the IPC standards is 50–210 μm (0.0020–0.0083 in).
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Finishing is the final step of the manufacturing process that gives wood surfaces desirable characteristics, including enhanced appearance and increased resistance to moisture and other environmental agents. Finishing can also make wood easier to clean [3] and keep it sanitized, sealing pores that can be breeding grounds for bacteria. Finishing ...
Since the oxidizing species such as water or oxygen are unable to diffuse through the mask, the nitride prevents the oxidation. Next, the etching process is used to etch the wafer and leave a small amount of oxide in the active areas. In the end, CMP is used to polish the SiO 2 overburden with an oxide on the active area.
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