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  2. Diffusion barrier - Wikipedia

    en.wikipedia.org/wiki/Diffusion_barrier

    A barrier metal is a material used in integrated circuits to chemically isolate semiconductors from soft metal interconnects, while maintaining an electrical connection between them. For instance, a layer of barrier metal must surround every copper interconnect in modern integrated circuits, to prevent diffusion of copper into surrounding ...

  3. LISICON - Wikipedia

    en.wikipedia.org/wiki/LISICON

    LISICON is an acronym for LIthium Super Ionic CONductor, [1] which refers to a family of solids with the chemical formula Li 2+2x Zn 1−x GeO 4. The first example of this structure was discovered in 1977, providing a chemical formula of Li 14 Zn(GeO 4 ) 4 .

  4. Nanoarchitectures for lithium-ion batteries - Wikipedia

    en.wikipedia.org/wiki/Nanoarchitectures_for...

    Beyond aperiodicity, these structures are used because the porous structure allows for rapid diffusion throughout the material, and the porous structure provides a large reaction surface. Fabrication is through coating the ambigel with a polymer electrolyte and then filling the void space with RuO 2 colloids that act as an anode. [19]

  5. Lithium–air battery - Wikipedia

    en.wikipedia.org/wiki/Lithium–air_battery

    A major advantage is the spontaneous formation of a barrier between anode and electrolyte (analogous to the barrier formed between electrolyte and carbon–lithium anodes in conventional Li-ion batteries) that protects the lithium metal from further reaction with the electrolyte.

  6. Atomic layer deposition - Wikipedia

    en.wikipedia.org/wiki/Atomic_layer_deposition

    Transition-metal nitrides, such as TiN and TaN, find potential use both as metal barriers and as gate metals. Metal barriers are used to encase the copper interconnects used in modern integrated circuits to avoid diffusion of Cu into the surrounding materials, such as insulators and the silicon substrate, and also, to prevent Cu contamination ...

  7. Scientists Find the Holy Grail: the Reason Why Lithium-Metal ...

    www.aol.com/scientists-holy-grail-reason-why...

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  8. Eutectic bonding - Wikipedia

    en.wikipedia.org/wiki/Eutectic_bonding

    The diffusion barrier avoids interaction between Au and Ti/Cr and requires higher temperatures to form a reliable and uniform bond. Further, the very limited solubility of silicon in titanium and chromium can prevent the developing of Au-Si eutectic composition based on the diffusion of silicon through titanium into gold.

  9. Lithium metal battery - Wikipedia

    en.wikipedia.org/wiki/Lithium_metal_battery

    The high specific capacity of lithium metal (3,860 mAh g −1), very low redox potential (−3.040 V versus standard hydrogen electrode) and low density (0.59 g cm −3) make it the ideal negative material for high energy density battery technologies. [71] Rechargeable lithium metal batteries can have a long run time due to the high charge ...