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  2. Pick-and-place machine - Wikipedia

    en.wikipedia.org/wiki/Pick-and-place_machine

    From the high speed machine, the board transits to a precision placement machine. These pick-and-place machines often use high resolution verification cameras and fine adjustment systems via high precision linear encoders on each axis to place parts more accurately than the high-speed machines.

  3. Metal electrode leadless face - Wikipedia

    en.wikipedia.org/wiki/Metal_electrode_leadless_face

    During automated SMT pick-and-place, this happens mostly if the mechanical pressure of the SMD placer nozzle is too low. If the MELF components are placed into the solder paste with enough pressure, then this problem can be minimized. Care must be taken with glass diodes which are less mechanically robust than resistors and other MELF components.

  4. Surface-mount technology - Wikipedia

    en.wikipedia.org/wiki/Surface-mount_technology

    Numerical control pick-and-place machines remove the parts from the tapes, tubes or trays and place them on the PCB. [7] The boards are then conveyed into the reflow soldering oven. They first enter a pre-heat zone, where the temperature of the board and all the components is gradually, uniformly raised to prevent thermal shock.

  5. Component placement - Wikipedia

    en.wikipedia.org/wiki/Component_placement

    The pick and place machine is often the most important piece of manufacturing equipment for placing components reliably and accurately enough to meet throughput requirements in a cost-effective manner. Typically, surface mount pick and place equipment, including a full complement of feeders constitute about 50% of the total capital investment ...

  6. Electronics industry - Wikipedia

    en.wikipedia.org/wiki/Electronics_industry

    Circuit boards are assembled largely using surface-mount technology, which typically involves the automated placement of electronic parts on circuit boards using pick-and-place machines. Surface-mount technology and pick-and-place machines make it possible to assemble large numbers of circuit boards at high speed.

  7. Semiconductor equipment maker ASML ships second 'High ... - AOL

    www.aol.com/news/semiconductor-equipment-maker...

    ASML, the biggest supplier of equipment to computer chip makers, said on Wednesday said it has shipped one of its newest "High NA" EUV lithography systems to a second customer. ASML, which shipped ...

  8. High performance positioning system - Wikipedia

    en.wikipedia.org/wiki/High_performance...

    Such a performance is required in semiconductor process equipment, electronics assembly lines, numerically controlled machine tools, coordinate-measuring machines, 3D Printing, pick-and-place machines, drug discovery assaying and many more.

  9. How innovation died at Intel: America's only leading-edge ...

    www.aol.com/finance/innovation-died-intel-faces...

    In 2024, Nvidia's stock is up 173%, while Arm, Broadcom (), and TSMC clocked 93%, 101%, and 92% gains, respectively.Yahoo Finance spoke with half a dozen Wall Street analysts and experts and more ...