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List of free analog and digital electronic circuit simulators, available for Windows, macOS, Linux, and comparing against UC Berkeley SPICE. The following table is split into two groups based on whether it has a graphical visual interface or not.
Copper interconnects are used in integrated circuits to reduce propagation delays and power consumption. Since copper is a better conductor than aluminium , ICs using copper for their interconnects can have interconnects with narrower dimensions, and use less energy to pass electricity through them.
Quite Universal Circuit Simulator (Qucs) is a free-software electronics circuit simulator software application released under GPL. It offers the ability to set up a circuit with a graphical user interface and simulate the large-signal, small-signal and noise behaviour of the circuit.
Dia has special objects to help draw entity-relationship models, Unified Modeling Language (UML) diagrams, flowcharts, network diagrams, and simple electrical circuits. It is also possible to add support for new shapes by writing simple XML files, using a subset of Scalable Vector Graphics (SVG) to draw the shape.
Global interconnects can transmit further, such as over large-area sub-circuits. Consequently, local interconnects may be formed from materials with relatively high electrical resistivity such as polycrystalline silicon (sometimes silicided to extend its range) or tungsten. To extend the distance an interconnect may reach, various circuits such ...
Free and open source software. Transparent source that is diffable. Mathematical formulas and text are nicely typeset. Vector graphics output (PDF, for example). If you already use LaTeX for preparing documents, drawing circuit diagrams is relatively easy to learn. Disadvantages: If you are new to LaTeX, the learning curve is pretty steep.
The BEOL process deposits metalization layers on the silicion to interconnect the individual devices generated during FEOL (bottom). CMOS fabrication process. Back end of the line or back end of line (BEOL) is a process in semiconductor device fabrication that consists of depositing metal interconnect layers onto a wafer already patterned with devices.
A thermal copper pillar bump, also known as a "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA).