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Sican tumi, or ceremonial knife, Peru, 850–1500 CE. Metallurgy in pre-Columbian America is the extraction, purification and alloying of metals and metal crafting by Indigenous peoples of the Americas prior to European contact in the late 15th century.
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
The chosen content of zinc depends on the required productivity and part configuration. High zinc improves the bath's efficiency (plating speed), while lower levels improve the bath's ability to throw into low current densities. Typically, the Zn metal level varies between 20 and 50 g/L (2.7-6.7 oz/gal). The pH varies between 4.8 and 5.8 units.
Black nickel plating was developed around 1905, and between the two wars, black chrome plating (first German patent 1929.GP 607, 420), which saw wider use only from the mid-1950s. [14] After the First World War, the first procedures for anodic oxidation and coloring of anodically oxidized aluminium were developed (1923, 1924.DRP. 413876).
Gold plating is a method of depositing a thin layer of gold onto the surface of another metal, most often copper or silver (to make silver-gilt), by a chemical or electrochemical (electroplating) process.
Electroless deposition is an important process in the electronic industry for metallization of substrates. Other metallization of substrates also include physical vapor deposition (PVD), chemical vapor deposition (CVD), and electroplating which produce thin metal films but require high temperature, vacuum, and a power source respectively. [20]
The electrolyte in the electrolytic plating cell should contain positive ions (cations) of the metal to be deposited. These cations are reduced at the cathode to the metal in the zero valence state. For example, the electrolyte for copper electroplating can be a solution of copper(II) sulfate , which dissociates into Cu 2+ cations and SO 2−
Barrel plating for electrical components (e.g. ceramic capacitors) used to grow terminals. Barrel plating is a form of electroplating used for plating a large number of smaller metal objects in one sitting. It consists of a non-conductive barrel-shaped cage in which the objects are placed before being subjected to the chemical bath in which ...
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