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  2. Surface-mount technology - Wikipedia

    en.wikipedia.org/wiki/Surface-mount_technology

    Alternatively, SMT and through-hole components can be soldered on the same side of a board without adhesive if the SMT parts are first reflow-soldered, then a selective solder mask is used to prevent the solder holding those parts in place from reflowing and the parts floating away during wave soldering. Surface mounting lends itself well to a ...

  3. Reflow oven - Wikipedia

    en.wikipedia.org/wiki/Reflow_oven

    A convection reflow oven. A reflow oven is a machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards (PCBs).. In commercial high-volume use, reflow ovens take the form of a long tunnel containing a conveyor belt along which PCBs travel.

  4. Reflow soldering - Wikipedia

    en.wikipedia.org/wiki/Reflow_soldering

    Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach anywhere from one to thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat. The solder paste reflows in a molten state, creating permanent ...

  5. Pick-and-place machine - Wikipedia

    en.wikipedia.org/wiki/Pick-and-place_machine

    Internal details of a two head, gantry style pick-and-place JUKI SMT machine. In the foreground are tape and reel feeders, then the (currently empty) conveyor belt for printed circuit boards, and in back are large parts in a tray. The gantry carries two pickup nozzles, flanking a camera (marked "do not touch" to avoid fingerprints on the lens).

  6. Thick-film technology - Wikipedia

    en.wikipedia.org/wiki/Thick-film_technology

    The development of the SMT process actually evolves from the thick film process. Also mounting of naked dies (the actual silicon chip without encapsulation) and wire bonding is a standard process, this provides the basis for miniaturization of the circuits as all the extra encapsulation is not necessary.

  7. Depaneling - Wikipedia

    en.wikipedia.org/wiki/Depaneling

    Four-PCB panel. Depaneling or depanelization is a process step in high-volume electronics assembly production. In order to increase the throughput of printed circuit board (PCB) manufacturing and surface mount (SMT) lines, PCBs are often arranged in a process called panelization so that they consist of many smaller individual PCBs that will be used in the final product.

  8. Hermes protocol - Wikipedia

    en.wikipedia.org/wiki/Hermes_protocol

    Hermes is a machine-to-machine communication standard used in the SMT assembly industry. [1]IPC-HERMES-9852. It is a successor to the SMEMA standard, introducing improvements such as: simpler physical wiring (Ethernet), use of popular data transmission formats (TCP/IP and XML), reduced number of barcode scanners (required only once at the beginning of the line), transmission of board data ...

  9. Wave soldering - Wikipedia

    en.wikipedia.org/wiki/Wave_soldering

    The basic equipment used during the process is a conveyor that moves the PCB through the different zones, a pan of solder used in the soldering process, a pump that produces the actual wave, the sprayer for the flux and the preheating pad. The solder is usually a mixture of metals.