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  2. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:

  3. Thermal management (electronics) - Wikipedia

    en.wikipedia.org/wiki/Thermal_management...

    Radial Heat Sink with Thermal Profile and Swirling Forced Convection Flow Trajectories (using CFD analysis) Pin Fin Heat Sink with Thermal Profile and Dione Convection Flow Trajectories (using CFD analysis) Heat sink in a workstation computer An artist's impression of a motherboard heat sink, rendered using POV-Ray Free convection ...

  4. Computer cooling - Wikipedia

    en.wikipedia.org/wiki/Computer_cooling

    A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.

  5. Why is my computer so slow? - AOL

    www.aol.com/products/blog/why-is-my-computer-so-slow

    Keep Hardware Clean and Well-Maintained: Regularly clean your computer's hardware components, including fans, vents and heat sinks to prevent overheating and performance degradation.

  6. Thermal interface material - Wikipedia

    en.wikipedia.org/wiki/Thermal_interface_material

    A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).

  7. Thermal design power - Wikipedia

    en.wikipedia.org/wiki/Thermal_design_power

    Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation. Some sources state that the peak power rating for a microprocessor is usually 1.5 times the TDP ...

  8. AOL Mail

    mail.aol.com/d?reason=invalid_cred

    Get AOL Mail for FREE! Manage your email like never before with travel, photo & document views. Personalize your inbox with themes & tabs. You've Got Mail!

  9. Air cooling - Wikipedia

    en.wikipedia.org/wiki/Air_cooling

    A Cooler Master computer heat sink has many heat pipes. CPU cooler Thermalright Le Grand Macho RT installed into the computer case. Air cooling is a method of dissipating heat. It works by expanding the surface area or increasing the flow of air over the object to be cooled, or both.