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Sila's Moses Lake plant is also located right across the road from REC Silicon, which will manufacture the silane that's used to make Titan Silicon. Sila will hire about 100 full-time employees ...
In 2022, Sila announced that it would supply powder to Mercedes Benz, its lead investor. [7] In April 2023, the company announced the availability of Titan Silicon, its first anode product. [8] In December 2023, Sila announced that it would supply Titan Silicon to Panasonic. It is building a factory in Moses Lake, Washington. [7]
An aide to Sen. Patty Murray read a message from the senator, and Sen. Maria Cantwell congratulated Sila by video. "This moment has been 12 years in the making," said Gene Berdichevsky, ...
The Alameda, California-based company is renovating a 600,000 square-foot factory in Moses Lake with plans to create as many as 500 new jobs to manufacture silicon anodes to be used in lithium-ion ...
Trisilaallene is a subclass of silenes derivatives where a central silicon atom forms double bonds with each of two terminal silicon atoms, with the generic formula R 2 Si=Si=SiR 2. Trisilaallene is a silicon-based analog of an allene , but their chemical properties are markedly different.
In September, 2021 Sila announced that it had begun shipping its first product, and that it had been incorporated in Whoop 4.0. [15] Group14 Technologies has patented a silicon-carbon composite SCC55, which enables 50% more in fully lithiated volumetric energy density than graphite used in conventional lithium-ion battery anodes.
Dec. 12—Sila Nanotechnologies officials announced this week the company has signed a deal with Panasonic Energy, a world-leading electric-vehicle battery producer. Just weeks prior, Sila began ...
There are several methods for 3D IC design, including recrystallization and wafer bonding methods. There are two major types of wafer bonding, Cu-Cu connections (copper-to-copper connections between stacked ICs, used in TSVs) [18] [19] and through-silicon via (TSV). 3D ICs with TSVs may use solder microbumps, small solder balls as an interface between two individual dies in a 3D IC. [20]