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Platform Environment Control Interface (PECI) is an Intel proprietary single wire serial interface that provides a communication channel between Intel processors and chipset components to external system management logic and thermal monitoring devices. Also, PECI provides an interface for external devices to read processor temperature, perform ...
The AMD Optimizing C/C++ Compiler (AOCC) is an optimizing C/C++ and Fortran compiler suite from AMD targeting 32-bit and 64-bit Linux platforms. [1] [2] It is a proprietary fork of LLVM + Clang with various additional patches to improve performance for AMD's Zen microarchitecture in Epyc, and Ryzen microprocessors.
Underclocking, also known as downclocking, is modifying a computer or electronic circuit's timing settings to run at a lower clock rate than is specified. Underclocking is used to reduce a computer's power consumption, increase battery life, reduce heat emission, and it may also increase the system's stability, lifespan/reliability and compatibility.
Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation.
Power consumption due to leakage power emanates at a micro-level in transistors. Small amounts of currents are always flowing between the differently doped parts of the transistor. The magnitude of these currents depend on the state of the transistor, its dimensions, physical properties and sometimes temperature.
This is generally known as Thermal Throttling in the case of reduction of clock speeds, or Thermal Shutdown in the case of a complete shutdown of the device or system. Cooling may be designed to reduce the ambient temperature within the case of a computer, such as by exhausting hot air, or to cool a single component or small area (spot cooling).
The CPU's clock speed and VCore are automatically decreased when the computer is under low load or idle, to save battery power, reduce heat and noise. The lifetime of the CPU is also extended because of reduced electromigration, which varies exponentially with temperature. [1] The technology is a concept similar to Intel's SpeedStep technology.
AMD Zen 3+ Family 19h – 2022 revision of Zen 3 used in Ryzen 6000 mobile processors using a 6 nm process. AMD Zen 4 Family 19h – fourth generation Zen architecture, in 5 nm process. [5] Used in Ryzen 7000 consumer processors on the new AM5 platform with DDR5 and PCIe 5.0 support. Adds support for AVX-512 instruction set.