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  2. Electroless nickel-phosphorus plating - Wikipedia

    en.wikipedia.org/wiki/Electroless_nickel...

    Electroless nickel-phosphorus plating, also referred to as E-nickel, is a chemical process that deposits an even layer of nickel-phosphorus alloy on the surface of a solid substrate, like metal or plastic. The process involves dipping the substrate in a water solution containing nickel salt and a phosphorus-containing reducing agent, usually a ...

  3. Electroless nickel-boron plating - Wikipedia

    en.wikipedia.org/wiki/Electroless_nickel-boron...

    Electroless nickel-boron plating developed as a variant of the similar nickel-phosphorus process, discovered accidentally by Charles Adolphe Wurtz in 1844. [2]In 1969, Harold Edward Bellis from DuPont filed a patent for a general class of electroless plating processes using sodium borohydride, dimethylamine borane, or sodium hypophosphite, in the presence of thallium salts, thus producing a ...

  4. Electroless nickel immersion gold - Wikipedia

    en.wikipedia.org/wiki/Electroless_nickel...

    Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.

  5. Electroplating - Wikipedia

    en.wikipedia.org/wiki/Electroplating

    Electroless processes are widely used to deposit nickel-phosphorus or nickel-boron alloys for wear and corrosion resistance, silver for mirror-making, copper for printed circuit boards, and many more. A major advantage of these processes over electroplating is that they can produce coatings of uniform thickness over surfaces of arbitrary shape ...

  6. Electroless deposition - Wikipedia

    en.wikipedia.org/wiki/Electroless_deposition

    Electroless deposition is advantageous in comparison to PVD, CVD, and electroplating deposition methods because it can be performed at ambient conditions. [2] [6] The plating method for Ni-P, Ni-Au, Ni-B, and Cu baths are distinct; however, the processes involve the same approach. The electroless deposition process is defined by four steps: [2 ...

  7. Electroforming - Wikipedia

    en.wikipedia.org/wiki/Electroforming

    Electroforming process detail. In the basic electroforming process, an electrolytic bath is used to deposit nickel or other electroformable metal onto a conductive surface of a model (mandrel). Once the deposited material has been built up to the desired thickness, the electroform is parted from the substrate.

  8. Electrochemical coloring of metals - Wikipedia

    en.wikipedia.org/wiki/Electrochemical_coloring...

    Electrochemical coloring of metals is a process in which the surface color of metal is changed by electrochemical techniques, i.e. cathodic or anodic polarization. The first method of electrochemical coloring of metals are certainly Nobili's colored rings, discovered by Leopoldo Nobili , an Italian physicist in 1826.

  9. Process flow diagram - Wikipedia

    en.wikipedia.org/wiki/Process_flow_diagram

    A process flow diagram (PFD) is a diagram commonly used in chemical and process engineering to indicate the general flow of plant processes and equipment. The PFD displays the relationship between major equipment of a plant facility and does not show minor details such as piping details and designations.

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