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  2. Copper interconnects - Wikipedia

    en.wikipedia.org/wiki/Copper_interconnects

    Copper interconnects are used in integrated circuits to reduce propagation delays and power consumption. Since copper is a better conductor than aluminium , ICs using copper for their interconnects can have interconnects with narrower dimensions, and use less energy to pass electricity through them.

  3. Via (electronics) - Wikipedia

    en.wikipedia.org/wiki/Via_(electronics)

    A via (Latin, 'path' or 'way') is an electrical connection between two or more metal layers of a printed circuit boards (PCB) or integrated circuit. Essentially a via is a small drilled hole that goes through two or more adjacent layers; the hole is plated with metal (often copper) that forms an electrical connection through the insulating layers.

  4. Interconnect (integrated circuits) - Wikipedia

    en.wikipedia.org/wiki/Interconnect_(integrated...

    In fabrication, interconnects are formed during the back-end-of-line after the fabrication of the transistors on the substrate. Interconnects are classified as local or global interconnects depending on the signal propagation distance it is able to support. The width and thickness of the interconnect, as well as the material from which it is ...

  5. New Cable-to-Board Interconnects from 3M Enable High ... - AOL

    www.aol.com/2013/10/04/new-cable-to-board...

    New Cable-to-Board Interconnects from 3M Enable High-Density Designs — Highly compact .050" pitch sockets and headers save PCB real estate — AUSTIN, Texas--(BUSINESS WIRE)-- A new cable-to ...

  6. Printed circuit board - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board

    A printed circuit board (PCB), also called printed wiring board (PWB), is a laminated sandwich structure of conductive and insulating layers, each with a pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto or between sheet layers of a non-conductive ...

  7. Microvia - Wikipedia

    en.wikipedia.org/wiki/Microvia

    At the electronic component level, this translates to components with increased I/Os with smaller footprint areas (e.g. flip-chip packages, chip-scale packages, and direct chip attachments), and on the printed circuit board and package substrate level, to the use of high density interconnects (HDIs) (e.g. finer lines and spaces, and smaller vias).

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