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  2. List of integrated circuit packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_integrated_circuit...

    Plastic leaded chip carrier (PLCC): square, J-lead, pin spacing 1.27 mm. Quad flat package (QFP): various sizes, with pins on all four sides. Low-profile quad flat-package (LQFP): 1.4 mm high, varying sized and pins on all four sides. Plastic quad flat-pack (PQFP), a square with pins on all four sides, 44 or more pins.

  3. Integrated circuit packaging - Wikipedia

    en.wikipedia.org/wiki/Integrated_circuit_packaging

    Dual in-line (DIP) integrated circuit metal lead frame tape with contacts. Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the ...

  4. Lead frame - Wikipedia

    en.wikipedia.org/wiki/Lead_frame

    Lead frame. A lead frame (pronounced / lid / LEED) is a metal structure inside a chip package that carries signals from the die to the outside, used in DIP, QFP and other packages where connections to the chip are made on its edges. Lead frame for a QFP package, before encapsulation. DIP 16 pin Lead frame, after encapsulation and before cutting ...

  5. TO-220 - Wikipedia

    en.wikipedia.org/wiki/TO-220

    The TO-220 is a style of electronic package used for high-powered, through-hole components with 0.1 inches (2.54 mm) pin spacing. The "TO" designation stands for "transistor outline". [2] TO-220 packages have three leads. Similar packages with two, four, five or seven leads are also manufactured. A notable characteristic is a metal tab with a ...

  6. Ball grid array - Wikipedia

    en.wikipedia.org/wiki/Ball_grid_array

    Ball grid array. A grid array of solder balls on a printed circuit board after removal of an integrated circuit chip. A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins ...

  7. Integrated circuit - Wikipedia

    en.wikipedia.org/wiki/Integrated_circuit

    A microscope image of an integrated circuit die used to control LCDs.The pinouts are the dark circles surrounding the integrated circuit.. An integrated circuit (IC), also known as a microchip, computer chip, or simply chip, is a small electronic device made up of multiple interconnected electronic components such as transistors, resistors, and capacitors.

  8. IsaKidd refining technology - Wikipedia

    en.wikipedia.org/wiki/IsaKidd_refining_technology

    A modern copper refinery tankhouse using IsaKidd technology. The IsaKidd Technology is a copper electrorefining and electrowinning technology that was developed independently by Copper Refineries Proprietary Limited (“CRL”), a Townsville, Queensland, subsidiary of MIM Holdings Limited (which is now part of the Glencore group of companies), and at the Falconbridge Limited (“Falconbridge ...

  9. Sheet resistance - Wikipedia

    en.wikipedia.org/wiki/Sheet_resistance

    Sheet resistance. Sheet resistance is the resistance of a square piece of a thin material with contacts made to two opposite sides of the square. [1] It is usually a measurement of electrical resistance of thin films that are uniform in thickness. It is commonly used to characterize materials made by semiconductor doping, metal deposition ...

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