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AlSi10Mg is a lightweight, high-strength aluminium alloy that is widely used in the aerospace, automotive, and medical industries. Its unique combination of aluminium , silicon , and magnesium makes it an ideal material for additive manufacturing processes, such as 3D printing .
The latter has a melting point of 1085 °C and is therefore thermally stable. Even clusters of magnesium and silicon atoms that are only metastable dissolve only slowly, due to the high binding energy of the two elements. Many standardised alloys have a silicon surplus.
The exact properties depend on whether the composition of the alloy is above, near or below the eutectic point. Castability increases with increasing Si content and is best at about 17% Si; the mechanical properties are best at 6% to 12% Si. The mold filling capacity reaches its maximum at 12% Si, but is also good with other contents.
This is normally carried out in a two-stage process at the point of manufacture into the desired shape, and then in a prolonged post-cure process. It can also be injection molded or 3D printed. Silicone rubber may be cured by a platinum-catalyzed cure system, a condensation cure system, a peroxide cure system, or an oxime cure system. For the ...
The Gmelin rare earths handbook lists 1522 °C and 1550 °C as two melting points given in the literature, the most recent reference [Handbook on the chemistry and physics of rare earths, vol.12 (1989)] is given with 1529 °C.
Boiling point (°C) K b (°C⋅kg/mol) Freezing point (°C) K f (°C⋅kg/mol) Data source; Aniline: 184.3 3.69 –5.96 –5.87 K b & K f [1] Lauric acid: 298.9 44 –3.9
The melting point (or, rarely, liquefaction point) of a substance is the temperature at which it changes state from solid to liquid. At the melting point the solid and liquid phase exist in equilibrium. The melting point of a substance depends on pressure and is usually specified at a standard pressure such as 1 atmosphere or 100 kPa.
Curie point: 152 °C [3] Density: 8.61 g cm −3: Melting point: 1399 °C Tensile strength (annealed) 586 MPa Tensile strength (stress relieved) 1030 MPa Tensile strength (hard) 1170 MPa Coefficient of thermal expansion: 12×10 −6 K −1 at 20 °C Specific heat: 0.523 J g −1 K −1 [4] Thermal conductivity: 29.7 W m −1 K −1 [5]