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A microscope image of an integrated circuit die used to control LCDs.The pinouts are the dark circles surrounding the integrated circuit.. An integrated circuit (IC), also known as a microchip or simply chip, is a set of electronic circuits, consisting of various electronic components (such as transistors, resistors, and capacitors) and their interconnections. [1]
Integrated Circuits are constructed from multiple layers of material, typically silicon, silicon dioxide , and aluminum. The composition and thickness of these layers give them their distinctive color and appearance. These elements created an irresistible palette for IC design and layout engineers.
A die shot or die photography is a photo or recording of the layout of an integrated circuit, showings its design with any packaging removed. A die shot can be compared with the cross-section of an (almost) two-dimensional computer chip, on which the design and construction of various tracks and components can be clearly seen. Due to the high ...
A photomask with several copies of the integrated circuit design is used to reduce the number of steppings required to expose the entire wafer, thus increasing productivity. Features 150 nm or below in size generally require phase-shifting to enhance the image quality to acceptable values. This can be achieved in many ways.
A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, [1] and may or may not cover the entire underside of the package.
A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography.
The first planar monolithic integrated circuit (IC) chip was demonstrated in 1960. The idea of integrating electronic circuits into a single device was born when the German physicist and engineer Werner Jacobi developed and patented the first known integrated transistor amplifier in 1949 and the British radio engineer Geoffrey Dummer proposed to integrate a variety of standard electronic ...
A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, [1] [2] so that they behave as a single device to achieve performance ...
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