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2. Flux (metallurgy) - Wikipedia

   en.wikipedia.org/wiki/Flux_(metallurgy)

   Rosin used as flux for soldering A flux pen used for electronics rework Multicore solder containing flux Wire freshly coated with solder, held above molten rosin flux. In metallurgy, a flux is a chemical reducing agent, flowing agent, or purifying agent. Fluxes may have more than one function at a time.

3. Granulation (jewellery) - Wikipedia

   en.wikipedia.org/wiki/Granulation_(jewellery)

   An improvement to this method is filing the solder to powder size and mixing it with the flux. The work area is painted with tragacanth and the granules are bedded on this using a fine brush. Having dried, the work is sprinkled with the flux-solder powder and heated to melting point.

4. Soldering - Wikipedia

   en.wikipedia.org/wiki/Soldering

   Another method for soldering is to place solder and flux at the locations of joints in the object to be soldered, then heat the entire object in an oven to melt the solder; toaster ovens and hand-held infrared lights have been used by hobbyists to replicate production soldering processes on a much smaller scale.

5. Reflow soldering - Wikipedia

   en.wikipedia.org/wiki/Reflow_soldering

   Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach anywhere from one to thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat. The solder paste reflows in a molten state, creating permanent ...

6. Selective soldering - Wikipedia

   en.wikipedia.org/wiki/Selective_soldering

   Regardless of the selective soldering equipment used, there are two types of selective flux applicators: spray and dropjet fluxers. The spray fluxer applies atomized flux to a specific area, while the dropjet fluxer is more precise; the choice depends on the circumstances surrounding the soldering application. [1]

7. Stencil printing - Wikipedia

   en.wikipedia.org/wiki/Stencil_Printing

   The equipment and materials used in this stage are a stencil, solder paste, and a printer. The stencil printing function is achieved through a single material namely solder paste which consists of solder metal and flux. Paste also acts as an adhesive during component placement and solder reflow. The tackiness of the paste enables the components ...