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Zen 2 is a computer processor microarchitecture by AMD.It is the successor of AMD's Zen and Zen+ microarchitectures, and is fabricated on the 7 nm MOSFET node from TSMC.The microarchitecture powers the third generation of Ryzen processors, known as Ryzen 3000 for the mainstream desktop chips (codename "Matisse"), Ryzen 4000U/H (codename "Renoir") and Ryzen 5000U (codename "Lucienne") for ...
Zen 2 also powers a line of mobile and desktop APUs marketed as Ryzen 4000, as well as fourth generation Xbox consoles and the PlayStation 5. The Zen 2 core microarchitecture is also used in the Mendocino APU, a 6 nm system on a chip aimed at mainstream mobile and other energy efficient low power computing products. [29]
In January 2018 AMD has announced their new lineup plans, with Ryzen 2. [183] AMD launched CPUs with the 12nm Zen+ [184] microarchitecture in April 2018, following up with the 7nm Zen 2 microarchitecture in June 2019, including an update to the Epyc line with new processors using the Zen 2 microarchitecture in August 2019, and Zen 3 slated for ...
Zen 2 is a 64-bit x86-64 instruction set CPU microarchitecture. The integrated GPU is also a custom unit based on AMD's RDNA 2 graphics architecture. [ 47 ] The GPU has 36 compute units running at a variable frequency capped at 2.23 GHz, making it capable of a peak theoretical performance of 10.28 teraFLOPS .
Zen 5 is the name for a CPU microarchitecture by AMD, shown on their roadmap in May 2022, [3] launched for mobile in July 2024 and for desktop in August 2024. [4] It is the successor to Zen 4 and is currently fabricated on TSMC's N4X process. [5] Zen 5 is also planned to be fabricated on the N3E process in the future. [6]
The AMD Optimizing C/C++ Compiler (AOCC) is an optimizing C/C++ and Fortran compiler suite from AMD targeting 32-bit and 64-bit Linux platforms. [1] [2] It is a proprietary fork of LLVM + Clang with various additional patches to improve performance for AMD's Zen microarchitecture in Epyc, and Ryzen microprocessors.
Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost). [i] Models with "F" suffixes are without iGPUs. Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O die).
The UVD 2.2 features a re-designed local memory interface and enhances the compatibility with MPEG2/H.264/VC-1 videos. However, it was marketed under the same alias as "UVD 2 Enhanced" as the "special core-logic, available in RV770 and RV730 series of GPUs, for hardware decoding of MPEG2, H.264 and VC-1 video with dual-stream decoding".