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Vinyl floor tiling. Vinyl composition tile (VCT) is a finished flooring material used primarily in commercial and institutional applications. Modern vinyl floor tiles and sheet flooring and versions of those products sold since the early 1980s are composed of colored polyvinyl chloride (PVC) chips formed into solid sheets of varying thicknesses (1 ⁄ 8 in or 3.2 mm is most common) by heat and ...
LI-900 is a type of reusable surface insulation tile developed and manufactured by Lockheed Missiles and Space Company in Sunnyvale, California. It was designed for use on the Space Shuttle orbiter as part of its thermal protection system to minimize thermal conductivity while providing maximum thermal shock resistance.
Ultra-high-temperature ceramics (UHTCs) are a type of refractory ceramics that can withstand extremely high temperatures without degrading, often above 2,000 °C. [1] They also often have high thermal conductivities and are highly resistant to thermal shock, meaning they can withstand sudden and extreme changes in temperature without cracking or breaking.
Both filled and unfilled EVA materials have good low temperature properties and are tough. The materials with approximately 11% VA are used as hot-melt adhesives. The EVA copolymer which is based on a high proportion of VA (greater than 60%) is referred to as ethylene-vinyl acetate rubber. [1]
TUFI tiles came in high temperature black versions for use in the orbiter's underside, and lower temperature white versions for use on the upper body. While more impact resistant than other tiles, white versions conducted more heat which limited their use to the orbiter's upper body flap and main engine area.
Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste (similar to thermal paste) or as a double-sided tape. [1] It is commonly used to bond integrated circuits to heatsinks where there are no other mounting mechanisms available.
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
In contrast, pressure-sensitive adhesives (PSAs) form a bond simply by the application of light pressure to marry the adhesive with the adherend. Pressure-sensitive adhesives are designed with a balance between flow and resistance to flow. The bond forms because the adhesive is soft enough to flow, or wet, the adherend.