Search results
Results from the WOW.Com Content Network
Wafers grown using materials other than silicon will have different thicknesses than a silicon wafer of the same diameter. Wafer thickness is determined by the mechanical strength of the material used; the wafer must be thick enough to support its own weight without cracking during handling. The tabulated thicknesses relate to when that process ...
Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in a semiconductor device fabrication process. Examples include production of radio frequency amplifiers, LEDs, optical computer components, and microprocessors for computers. Wafer ...
Wafering is the process by which a silicon crystal is made into wafers. This process is usually carried out by a multi-wire saw which cuts multiple wafers from the same crystal at the same time. These wafers are then polished to the desired degree of flatness and thickness.
The crystal ingots from which wafers are sliced can be up to 2 metres in length, weighing several hundred kilograms. Larger wafers allow improvements in manufacturing efficiency, as more chips can be fabricated on each wafer, with lower relative loss, so there has been a steady drive to increase silicon wafer sizes.
Etching a (100) silicon surface through a rectangular hole in a masking material, like a hole in a layer of silicon nitride, creates a pit with flat sloping {111}-oriented sidewalls and a flat (100)-oriented bottom. The {111}-oriented sidewalls have an angle to the surface of the wafer of:
The funds for projects in Texas and Missouri will establish the first high-volume U.S. production of 300-mm wafers for advanced semiconductors and expand production of silicon-on-insulator wafers ...
Wafer mounting is a step that is performed during the die preparation of a wafer as part of the process of semiconductor fabrication. During this step, the wafer is mounted on a plastic tape that is attached to a ring. Wafer mounting is performed right before the wafer is cut into separate dies. The adhesive film upon which the wafer is mounted ...
A stepper or wafer stepper is a device used in the manufacture of integrated circuits (ICs). It is an essential part of the process of photolithography, which creates millions of microscopic circuit elements on the surface of silicon wafers out of which chips are made.