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Electrostatically actuated RF MEMS components offer low insertion loss and high isolation, linearity, power handling and Q factor, do not consume power, but require a high control voltage and hermetic single-chip packaging (thin film capping, LCP or LTCC packaging) or wafer-level packaging (anodic or glass frit wafer bonding).
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge .
Integrated circuit packaging is the last assembly process before testing and shipping devices to customers. Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate.
Advanced Microelectronics Packaging and Interconnection (smaller, faster, more powerful, and cost-competitive). Hardware Systems Engineering (tools and methodologies for cost-efficient, up-front design of advanced electronic systems, including modelling and design-for-test techniques to improve cost, yield, quality, and time-to-market).
Materials demand is driven by substrates, making up over 70 percent of the market, packaging coatings and increasing use of chemical mechanical planarization (CMP). While MEMS manufacturing continues to be dominated by used semiconductor equipment, there is a migration to 200mm lines and select new tools, including etch and bonding for certain ...
He is known for his work on phase-change heat/mass transfer with droplets and bubbles, multi-phase flows, buoyancy-driven transport, and ionized arc-plasma transport with applications in condensation, combustion, microelectronic packaging, and micro-/macro-biological systems. [3] He is the recipient of the 2014 Max Jakob Memorial Award.
Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a " package ", supports the electrical contacts which connect the device to a circuit board.
Packaging challenges often account for 75–95% of the overall costs of MEMS and NEMS. Factors of wafer dicing, device thickness, sequence of final release, thermal expansion, mechanical stress isolation, power and heat dissipation, creep minimization, media isolation, and protective coatings are considered by packaging design to align with the ...