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Advanced Microelectronics Packaging and Interconnection (smaller, faster, more powerful, and cost-competitive). Hardware Systems Engineering (tools and methodologies for cost-efficient, up-front design of advanced electronic systems, including modelling and design-for-test techniques to improve cost, yield, quality, and time-to-market).
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge .
Aeroflex Inc. was an American company which produced test equipment, RF and microwave integrated circuits, components and systems used for wireless communications. Its headquarters were located in Plainview , New York . [ 2 ]
Micro Electronics, Inc. (MEI) is an American privately held company headquartered in Hilliard, Ohio.Founded in 1979 by John Baker, [1] it serves as the parent company of the computer retailer Micro Center, its online division Micro Center Online, and its brand iPSG, [2] which houses PowerSpec PC, WinBook, and Inland (including Inland Premium for high-end SSDs).
In 2000, WaferScale Integration Inc. (WSI, Fremont, California), a vendor of EPROM and flash memory-based programmable system-chips; [4] In 2002, Alcatel's Microelectronics division, which along with the incorporation of smaller ventures such as UK company, Synad Ltd, helped the company expand into the Wireless-LAN market;
Integrated circuit packaging is the last assembly process before testing and shipping devices to customers. Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate.
Tongfu Microelectronics (TFME; Chinese: 通富微电; pinyin: Tōngfù Wéidiàn) is a publicly listed Chinese semiconductor company headquartered in Nantong, Jiangsu.. It is one of the largest Outsourced Semiconductor Assembly and Test (OSAT) companies in mainland China.
Onto Innovation Inc. is an American semiconductor company formed in 2019 from the merger of Rudolph Technologies, Inc. and Nanometrics Incorporated. It is a provider of process and process control equipment and software for microelectronic manufacturing industries (primarily semiconductor device manufacturing). The company's product offering ...