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Laser cutting. Laser cutting is a technology that uses a laser to vaporize materials, resulting in a cut edge. While typically used for industrial manufacturing applications, it is now used by schools, small businesses, architecture, and hobbyists. Laser cutting works by directing the output of a high-power laser most commonly through optics.
Laser beam machining (LBM) is a form of machining that uses heat directed from a laser beam. This process uses thermal energy to remove material from metallic or nonmetallic surfaces. The high frequency of monochromatic light will fall on the surface, thus heating, melting and vaporizing the material due to the impinge of photons (see Coulomb ...
Laser metal deposition (LMD) is an additive manufacturing process in which a feedstock material (typically a powder) is melted with a laser and then deposited onto a substrate. [1] A variety of pure metals and alloys can be used as the feedstock, as well as composite materials such as metal matrix composites .
The use of lasers in Micro Materials Processing has found broad application in the development and manufacturing of screens for smartphones, tablet computers, and LED TVs. [14] A detailed list of industrial and commercial laser applications includes: Laser cutting. Laser welding.
Selective laser melting (SLM) is one of many proprietary names [1] for a metal additive manufacturing (AM) technology that uses a bed of powder with a source of heat to create metal parts. Also known as direct metal laser sintering (DMLS), the ASTM standard term is powder bed fusion (PBF). PBF is a rapid prototyping, 3D printing, or additive ...
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] Die singulation comes after the photolithography process. It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.
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